发明名称 |
LID HOLDING FRAME FOR ELECTRONIC PART, ITS MANUFACTURING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC PART USING THE SANE |
摘要 |
<P>PROBLEM TO BE SOLVED: To improve productivity of an electronic part by enhancing the efficiency of a sealing step of a container for the part corresponding to a lid for the part in a method for manufacturing the part of a hollow package, and to contribute to the improvement in reliability of the part by improving the step reliability of the method. <P>SOLUTION: The method for manufacturing the electronic part includes the steps of opposing a container holding frame 23 for connecting to and holding a lid holding frame 30 for connecting and holding the lid 21, for a plurality of the electronic parts formed by a mold for molding to a frame 34 and the container 22 for the plurality of the electronic parts to a frame 24; aligning the frames in a frame-to-frame manner; simultaneously connecting the lid 21 for the parts to the corresponding container for the parts without removing the lid 21; changing relative positions of the respective frames; and releasing the lid 21 from the frame 30. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004087696(A) |
申请公布日期 |
2004.03.18 |
申请号 |
JP20020245400 |
申请日期 |
2002.08.26 |
申请人 |
NEC COMPOUND SEMICONDUCTOR DEVICES LTD;NEC KANSAI LTD |
发明人 |
KURIHARA TOSHIMICHI;UEDA TAKASHI |
分类号 |
H01L23/02;H01L21/00;H01L21/50;H01L21/68;H01L23/04;H01L23/08;H01L23/10 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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