发明名称 LIGHT EMITTING ELEMENT ARRAY CHIP AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To reduce a variation of an emission quantity of light in a light emitting element chip. <P>SOLUTION: A dummy light emitting element L<SB>D</SB>is arranged at a region more outside than both end light emitting elements L<SB>1</SB>and L<SB>128</SB>used as light emitting elements. The dummy light emitting element L<SB>D</SB>is constructed in the same structure as that of the other light emitting elements L<SB>1</SB>-L<SB>128</SB>. By this structure, connecting parts of both end light emitting elements to be actually used as light emitting elements to anode electrodes can be formed by patterning without breaking the pattern continuity, so that connecting parts at all light emitting elements to be used can be made uniform in dimensions. Since connecting parts which partly block light emitting regions can be uniformed in dimensions at all light emitting elements, and emission areas of the light emitting regions can be made uniform, a good SLED chip without any variation of the emission quantity of light can be manufactured accordingly. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004082651(A) 申请公布日期 2004.03.18
申请号 JP20020249987 申请日期 2002.08.29
申请人 NIPPON SHEET GLASS CO LTD 发明人 OTSUKA SHUNSUKE
分类号 B41J2/44;B41J2/45;B41J2/455;H01L33/08;H01L33/40;H01L33/58 主分类号 B41J2/44
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