IC MODULE, SUBSTRATE INCLUDING IC MODULE AND MANUFACTURING METHOD OF SUBSTRATE INCLUDING IC MODULE

摘要

PROBLEM TO BE SOLVED: To provide an IC module strong against bending stress, etc., a substrate including the IC module and a manufacturing method of a substrate including the IC module.

SOLUTION: The IC module 10 and the substrate 30, 50 including the IC module 10 are provided with reinforcement members 12, 13 for reinforcing an integrated circuit having an electrode 11a on upper and lower surfaces of the integrated circuit 11 in the integrated circuit.

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