| 摘要 |
PROBLEM TO BE SOLVED: To provide a member for processing a semiconductor wafer whereby the slips on the semiconductor wafer are reduced and proper adhesion with the semiconductor wafer is obtained with high durability. SOLUTION: In a member A for processing the semiconductor wafer, the member having at least an SiC film C formed on the surface of the member, a placing portion for placing the semiconductor wafer thereon comprises convex portions 1 practically making contact with the semiconductor wafer and concave portions 2 which are formed between the convex portions 1 and keep a surface state of the formed film. An upper surface 1a of the convex portion 1 has a surface roughness Ra of 0.05 to 1.3μm. COPYRIGHT: (C)2004,JPO |
