发明名称 METHOD OF SOLDERING FP COIL AND FP WIRING BOARD TOGETHER, AND MOTOR
摘要 PROBLEM TO BE SOLVED: To solder an FP coil and an FP wiring board so that solder fusing and flowing at soldering is not connected to other patterns. SOLUTION: In the case of soldering the solder-plated terminal 25 of the FP coil 20 used as a stator in a motor for a rotary drum device or the like and the solder-plated wiring 35 of the FP wiring board 30 connected to the FP coil 20, the terminal 25 of the FP coil 20 is formed with a plurality of slits S having escape ways for air, and the connection between the FP coil 20 and the FP wiring board 30 is heated and pressurized for soldering. Fusing and flowing surplus solder is settled in the slits S and does not contact with adjacent patterns. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004088827(A) 申请公布日期 2004.03.18
申请号 JP20020242840 申请日期 2002.08.23
申请人 SONY CORP 发明人 SUZUKI KEIGO
分类号 H02K3/26;H02K3/04;H02K3/47;H02K3/50;H02K15/04;H02K21/24;(IPC1-7):H02K3/26 主分类号 H02K3/26
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