发明名称 ELECTROLYTIC TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To more uniformly electrolyze the whole surface of a substrate so as to give an enhanced uniformity within the face, even when a size of the substrate is enlarged and the film thickness of a feed layer becomes thin. SOLUTION: In an electrolytic treatment apparatus for electrolyzing the substrate W which is held by a substrate holder 10 and is made to be either one electrode of a cathode or an anode by coming in contact with a feeding contact 18, after filling an electrolytic liquid Q between the substrate W and a counter electrode 22 placed in a position facing with the substrate W, this electrolytic treatment apparatus comprises an electric-field-correcting body 32 which is arranged between the counter electrode 22 and the substrate W held by the substrate holder 10, and has an approximately same effective region as an effective area of the substrate W, and a moving mechanism for moving the substrate holder 10 and the counter electrode 22 relatively in parallel. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004083932(A) 申请公布日期 2004.03.18
申请号 JP20020242726 申请日期 2002.08.22
申请人 EBARA CORP 发明人 MISHIMA KOJI;KANDA HIROYUKI
分类号 C25D7/12;C25D17/08;C25D21/00;C25D21/10;C25D21/12;H01L21/288;H01L21/3063;(IPC1-7):C25D21/12;H01L21/306 主分类号 C25D7/12
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