发明名称 STRIP LINE DEVICE, MEMBER TO BE MOUNTED ON PRINTED WIRING BOARD, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND ITS FABRICATING METHOD
摘要 <p>Electromagnetic waves leaking from a power distribution circuit provided on a printed wiring substrate or in a semiconductor package are suppressed, and degradation of the waveform of a signal generated by a high-speed digital circuit. A strip line device comprises an elongated metal plate (10) having a valve action and coated with a dielectric film (20). A conductive layer (30) is formed to cover the valve-acting metal, with the dielectric film (20) interposed therebetween. The characteristic impedance as seen from its input terminal can be low over a wide range.</p>
申请公布号 WO2004023597(A1) 申请公布日期 2004.03.18
申请号 WO2003JP11209 申请日期 2003.09.02
申请人 NEC CORPORATION;TOHYA, HIROKAZU;MASUDA, KOICHIRO;SHIMIZU, HIDEKI 发明人 TOHYA, HIROKAZU;MASUDA, KOICHIRO;SHIMIZU, HIDEKI
分类号 H01G9/012;H01L23/50;H01L23/66;H01P3/08;H05K1/02;H05K3/22;(IPC1-7):H01P3/08;H01G9/00;H01G4/00 主分类号 H01G9/012
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