发明名称 |
STRIP LINE DEVICE, MEMBER TO BE MOUNTED ON PRINTED WIRING BOARD, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND ITS FABRICATING METHOD |
摘要 |
<p>Electromagnetic waves leaking from a power distribution circuit provided on a printed wiring substrate or in a semiconductor package are suppressed, and degradation of the waveform of a signal generated by a high-speed digital circuit. A strip line device comprises an elongated metal plate (10) having a valve action and coated with a dielectric film (20). A conductive layer (30) is formed to cover the valve-acting metal, with the dielectric film (20) interposed therebetween. The characteristic impedance as seen from its input terminal can be low over a wide range.</p> |
申请公布号 |
WO2004023597(A1) |
申请公布日期 |
2004.03.18 |
申请号 |
WO2003JP11209 |
申请日期 |
2003.09.02 |
申请人 |
NEC CORPORATION;TOHYA, HIROKAZU;MASUDA, KOICHIRO;SHIMIZU, HIDEKI |
发明人 |
TOHYA, HIROKAZU;MASUDA, KOICHIRO;SHIMIZU, HIDEKI |
分类号 |
H01G9/012;H01L23/50;H01L23/66;H01P3/08;H05K1/02;H05K3/22;(IPC1-7):H01P3/08;H01G9/00;H01G4/00 |
主分类号 |
H01G9/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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