| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical data link having a structure in which possibility of thermal interference between electronic components is reduced. <P>SOLUTION: An optical data link 10a is provided with a housing 20, a circuit board 26, a protecting member 34a, a semiconductor chip 34b, an optical element sub-assembly 24, a heat transmitting member 44, and a heat transmitting member 46. The semiconductor chip 34b is provided on the circuit board 26. The holding member 34a indicates electric insulating features and covers the semiconductor chip 34b. The optical element sub-assembly 24 includes semiconductor optical elements connected to a conductive layer on the circuit board 26 and is packaged on a packaging member 22. The heat transmitting member 44 is contacted to the housing 20 and the protecting member 34a. The heat transmitting member 46 is contacted to the housing 20 and the optical element sub-assembly 24. There is an interval between the heat transmitting member 44 and the heat transmitting member 46. <P>COPYRIGHT: (C)2004,JPO |
