发明名称 APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enable a material having a high wear resistance to be used by facilitating assembly of a die for forming a die for cutting a tie bar and suppressing the wear of the die at a working time. SOLUTION: Slits 3 corresponding to the number of leads and continued from the inside to the outside are formed on an upper surface 1A of each side forming the die 1. Thus, since a comb-like cutter 2 is formed long continued from the inside to the outside, a stress can be relaxed. Further, since the slits 3 are formed by moving a disc-shape grinding stone in parallel on an upper surface 1A, a damage at a working time is small, the wear resistance is improved, and a material having the low wear resistance can be used. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004087702(A) 申请公布日期 2004.03.18
申请号 JP20020245486 申请日期 2002.08.26
申请人 NEC SEMICONDUCTORS KYUSHU LTD 发明人 KAWADA KEIICHI
分类号 B21D28/00;B21D28/34;B21D37/01;B21D37/20;H01L23/50;(IPC1-7):H01L23/50 主分类号 B21D28/00
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