| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that the operation efficiency of a conventional multi-chamber system is low because the system uses a plurality of chambers for etching-only chambers or ashing-only chambers, requires much time for one processing of long processing time and makes the other processing of short processing time waiting for the end of the processing of the longer processing time. SOLUTION: In the case of processing two sorts of wafers W in which relation of the length of the etching time and that of the ashing time is reversed from each other by using a multi-chamber system 10 provided with 1st to 4th process chambers 11-14 and a carrier arm 15A in the processing method of the multi-chamber system, a wafer W whose ashing time is longer than the etching time is processed by chamber arrangement having many ashing chambers and then the ashing chambers are cleaned during the substitution of the processed wafer W to arrange many etching chambers and process a wafer W of the other sort. COPYRIGHT: (C)2004,JPO |
