| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module with an area of its laminated dielectric board decreased and without being affected in heat dissipation. SOLUTION: The high-frequency module comprises a first dielectric substrate 101; a first semiconductor chip 102 including an active element; a second ring-shaped dielectric substrate 104; a second semiconductor chip 105, including the active element arranged in the ring of the second dielectric substrate 104; an electrode pad 107, formed on a second main surface of the second dielectric substrate; and a first and second sealers 108 and 110 formed so as to cover the first and second semiconductor chips. Power consumption of the first semiconductor chip 102 is larger than that of the second semiconductor chip 105. COPYRIGHT: (C)2004,JPO
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