| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated structure for transmitting high frequency signal, which is capable of moving a resonance frequency to a higher frequency side, impedance-matched even in high frequency, and a high frequency semiconductor package using the same. SOLUTION: At least a pair of ground conductors of the vertical wall part are provided so as to stride over a lead terminal on the end parts of a laminated substrate so that a resonance frequency is moved to a higher frequency side and the impedance matching is made in high frequency. COPYRIGHT: (C)2004,JPO
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