| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a tape carrier for a semiconductor device can be packed by further reducing warping of the tape carrier without increasing the warping after the tape carrier is shipped and packed. SOLUTION: At the time of shipping the tape carrier constituted by forming a circuit wiring pattern 3, such as chip mounting sections etc., on a tape-like substrate 2, a first step of reducing warping of the tape carrier 1 by drying the carrier 1 in a state where the carrier 1 is wound around a reel and a second step of packing the tape carrier 1a reduced in warping through the drying performed in the first step by enclosing the carrier 1a in a packing bag 8 in a short time so that the carrier 1a may not warp again. COPYRIGHT: (C)2004,JPO
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