| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is less affected by its deformation after mounting. SOLUTION: A first silicon board 304 equipped with a first circuit and a second silicon board 302 equipped with a second circuit whose minimum line width is smaller than that of the first circuit are joined together in a flip chip mounting manner for the formation of the semiconductor device. The first silicon board 304 is thinner than the second silicon board 302. That is, the silicon board (element) with interconnect lines which are large in line width is set smaller in thickness than the other element, whereby distortion caused by thermal shrinkage is concentrated on the thinner silicon board or the silicon board having the wide interconnect lines. By this setup, the silicon board equipped with interconnect lines which are fine and weak to deformation is less deformed, and the semiconductor device is less affected by its deformation after mounting. COPYRIGHT: (C)2004,JPO
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