Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module

摘要

The invention concerns a method for shielding at least the upper part of a radiocommunication module (1), said module being designed to be transferred on a mother board (5) and including components mounted on a printed circuit and providing at least one of the following functions. RF processing, digital processing and analog processing. The inventive method is characterised in that it comprises the following steps: coating at least the upper part (2) of said radiocommunication module with a resin and adding an electrically conductive layer at the surface of the resin. The invention also concerns a radiocommunication module whereof at least the upper part is thus shielded.