PROBING METHOD, PROBE, AND MECHANISM FOR REDUCING/PLASMA ETCHING ELECTRODE

摘要

A probing method comprising a step for reducing the electrode of a wafer W using a forming gas, and a step for contacting a probe pin (14A) with the electrode in a dry atmosphere. Prior to reducing the electrode P of an article under inspection, the article is heated in an inert gas atmosphere and reduction is carried out by contacting a reducing gas with the electrode of the article under inspection under a normal pressure.