| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a multilayer wiring board in which reliability can be enhanced by protecting a resin filling body in the through hole of a metal plate against cracking or generation of a void. SOLUTION: The multilayer wiring board is produced according to a following procedure. At first, a metal plate 12 having a thickness of 150-500μm is prepared. An etching resist 81 having a thickness of 20-100μm is formed on the first major surface 13 and the second major surface 14 and then etching is performed simultaneously on the opposite sides thus making a through hole 15 having a diameter not larger than 500μm in the metal plate 12. Subsequently, the etching resist 81 is removed and a resin insulating layer is formed by applying a filmlike insulating resin material onto the first major surface 13 and the second major surface 14. At the same time, the through hole 15 is filled with the insulating resin material thus forming a resin filled body. COPYRIGHT: (C)2004,JPO |
