| 摘要 |
PROBLEM TO BE SOLVED: To bond two chips to the opposite sides of a carrier, e.g. a wiring board. SOLUTION: The bonder 30 comprises a feeder 32 for pitch feeding a wiring board 20, a pickup head 77 for picking up a chip 10, aΘ-axis robot 75 for inverting the pickup head 77, a first bonding head 44 for receiving the chip 10 picked up by means of the pickup head 77 and bonding it to the lower surface of the wiring board 20, and a second bonding head 56 for receiving the chip 10 picked up and inverted by means of the pickup head 77 and bonding it to the upper surface of the wiring board 20. Two chips can thereby be bonded simultaneously to the opposite sides of the wiring board by means of the first and second bonding heads. Since a memory module having chips on the opposite sides of the wiring board can be produced by means of a single bonder, investment in plant and equipment, production cost and production time can be reduced. COPYRIGHT: (C)2004,JPO
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