| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding substrate wherein a semiconductor wafer with a controlled quantity of warpage is adhered and held. SOLUTION: The die is used for adhesion in a method for manufacturing a thin wafer that is manufactured by adhering a circuit surface (A surface) of the semiconductor wafer and a holding substrate with each other with an adhesive film, polishing an exposed surface (rear surface: B surface) of the semiconductor wafer to make the wafer thin, optionally applying metallization treatment to the B surface, and peeling off the thin wafer from the holding substrate. The die is comprised of a female die wherein the holding substrate and the adhesive film and a cushion matreial as necessary are arranged, and a male die corresponding to the recessed part of a female die to constitute a smoothly paired structure. The bottom center of the female die has a smooth and curved surface that is recessed by 0.1-2mm to the outer circumference of the bottom corresponding to that of the wafer, while the projected surface of the male die is a smooth projected surface corresponding to the recessed curved surface of the female die. COPYRIGHT: (C)2004,JPO
|
