| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which a high speed operation IP core mounted on a system LSI can be inspected at the actual operating speed with high precision in the wafer level, and to provide its inspecting method. SOLUTION: A circuit 101 is inspected by connecting a probe, connected with a test means 105, with the inspection I/O pads of a plurality of semiconductor integrated circuit devices 100 having I/O pads 103 and inspection I/O pads 102 provided in the vicinity of the circuit 101 to be inspected. COPYRIGHT: (C)2004,JPO
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