发明名称 Apparatus and method for delivering process gas to a substrate processing system
摘要 A method and apparatus for delivering process fluids to a substrate processing system is described herein. In one embodiment, the fluid delivery system may include a first conduit for coupling a first fluid to the substrate processing system with a first flow controller for controlling the flow of the first fluid through the first conduit; a second conduit for coupling a second fluid to the substrate processing system with a second flow controller for controlling the flow of the second fluid through the second conduit; and a third conduit for coupling the second fluid to the substrate processing system with a third flow controller for controlling the flow of the second fluid through the third conduit. The fluid delivery system may be used to deliver processing fluids to a substrate processing system during semiconductor fabrication.
申请公布号 US2004050325(A1) 申请公布日期 2004.03.18
申请号 US20020243377 申请日期 2002.09.12
申请人 SAMOILOV ARKADII V.;COMITA PAUL B. 发明人 SAMOILOV ARKADII V.;COMITA PAUL B.
分类号 C23C16/44;C23C16/455;H01L21/00;(IPC1-7):C23C16/00;C23F1/00 主分类号 C23C16/44
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