发明名称 |
Doping a semiconductor body used for production of compensation components in high voltage elements comprises implanting doping centers of ions producing a conducting type in the semiconductor body, and heat treating |
摘要 |
Doping a semiconductor body (1, 2) comprises implanting doping centers of the ions (6) producing a conducting type in the semiconductor body, and heat treating using ion radiation so that doping of the conducting type prevails in the semiconductor body. Further heat treatment is carried out in determined regions in the semiconductor body at a higher temperature than that of the first heat treatment.
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申请公布号 |
DE10260644(B3) |
申请公布日期 |
2004.03.18 |
申请号 |
DE20021060644 |
申请日期 |
2002.12.23 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
RUEB, MICHAEL |
分类号 |
H01L21/265;H01L21/268;(IPC1-7):H01L21/265 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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