| 摘要 |
PROBLEM TO BE SOLVED: To solve problems in which when a printed circuit board is soldered by a conventional partial soldering method, oxide of the solder and carbide of the flux stick on a soldered zone, an icicle, a bridge, or an excessive is produced, and further sufficient solder does not enter a through hole. SOLUTION: Molten solder is jetted from a jet nozzle, before being the printed circuit board into contact with the soldering zone, to remove the oxide of solder and carbide of flux sticking to the jet nozzle, the jet nozzle is sufficiently heated with the molten solder, and then the printed circuit board is elevated to a position where the solder is not broken while the fused solder is still sticking to the printed circuit board; and then the molten solder is slowly lowered and cut solder. COPYRIGHT: (C)2004,JPO |
