摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor module short-term in an assembling time, high in reliability and long in life. SOLUTION: In the optical semiconductor module, an electronic cooling element is loaded in an air-tight sealed vessel, and the distributing electrode of the electronic cooling element is connected electrically to a distributing pattern on the ceramics terminal of the optical semiconductor air-tight sealed vessel through a metal wire. A time required for soldering is remarkably shortened by employing the wire. Further, the metal wire is preferable to select the optimum material and length so as to satisfy the relation of (ρ×I<SP>2</SP>×L<SP>2</SP>)/(8×κ×S<SP>2</SP>)<30 in the formula I. According to this method, higher reliability and longer life are realized. COPYRIGHT: (C)2004,JPO |