POLYAMIC ACID MIXTURE, POLYIMIDE, POLYIMIDE FILM AND USE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polyamic acid mixture as a precursor of a polyimide which can give a polyimide film having excellent punchability, to provide the polyimide formed out of the polyamic acid mixture, to provide the polyimide film having the excellent punchability, and to provide a flexible circuit board and a stiffener utilizing the same. SOLUTION: This polyamic acid mixture contains 0.1-10 wt% of (B) a polyamic acid which is a heat-curable polyimide or a precursor of the heat-curable polyimide in (A) another polyamic acid which is a precursor of a non-thermoplastic polyimide. COPYRIGHT: (C)2004,JPO