发明名称 Circuit board where circuit terminals are interconnected and method of fabricating the same
摘要 A circuit board includes a substrate having a top surface and a bottom surface and including circuit patterns disposed on the top and bottom surfaces thereof, the substrate defining a connection hole therein; an upper terminal electrically connected to a circuit pattern formed on the top surface of the substrate; a lower terminal electrically connected to a circuit pattern formed on the bottom surface of the substrate, the lower terminal being located opposite to the upper terminal; and wherein the upper terminal and the lower terminal are bonded inside the connection hole of the substrate for electrical connection there-between. A method of fabricating the circuit board is also disclosed.
申请公布号 US2004050586(A1) 申请公布日期 2004.03.18
申请号 US20030458400 申请日期 2003.06.10
申请人 ROH HYOUNG-HO 发明人 ROH HYOUNG-HO
分类号 H05K1/11;H05K3/32;H05K3/40;(IPC1-7):H05K1/16;H05K3/36 主分类号 H05K1/11
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