SEMICONDUCTOR ETCHING APPARATUS MOUNTED WITH DISC-TYPE SEALING PLATE

摘要

PURPOSE: A semiconductor etching apparatus mounted with a disc-type sealing plate is provided to accomplish etch uniformity on the surface of a wafer by making the flow of etch gas inside an etching chamber uniform. CONSTITUTION: A cylindrical etching chamber(102) includes a pumping port(106), made of a wall. A gas supply unit(101) supplies necessary gas for an etching process to the etching chamber. A cylindrical cathode supports the wafer(104), located in the center of the lower surface in the cylindrical etching chamber. A gas exhaust unit(105) absorbs the residual gas in the etching chamber and byproducts through the pumping port. Two disc-type sealing plates(201) contact the inner wall of the cylindrical etching chamber and the outer surface of the cylindrical cathode, contacting each other. A plurality of gas exhaust holes are uniformly formed on the surface of the cylindrical sealing plates.