| 发明名称 |
Method and system for removing heat from an active area of an integrated circuit device |
| 摘要 |
<p>A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator. <IMAGE></p> |
| 申请公布号 |
EP1385206(A3) |
申请公布日期 |
2004.03.17 |
| 申请号 |
EP20030254327 |
申请日期 |
2003.07.08 |
| 申请人 |
STMICROELECTRONICS, INC. |
发明人 |
SIEGEL, HARRY MICHAEL |
| 分类号 |
H01L23/31;H01L23/36;H01L23/40;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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