High performance passive cooling device with ducting

摘要

A passive cooling device 10 for removing waste heat from a component 50 is disclosed. The passive cooling device 10 includes a heat mass 11 and a stem 13 extending outward therefrom and including a plurality of fins 24 with stem slots SS therebetween. A plurality of vanes 21 that include fins 23 formed therein surround the stem 13 and define a chamber 30. A duct 90 connects with a top face 29 of the vanes 21 and an air flow source 70 that generates an air flow F through the chamber 30, the stem fins 24, the fins 23, and the vanes 21 to dissipate heat from the heat mass 11. The air flow source 70 can supply a positive FP or a negative FN air flow.