半导体装置,申请号CN03343024.1-传众专利搜索

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法人/股东/高管

发明名称	半导体装置
摘要
申请公布号	CN3357314D	申请公布日期	2004.03.17
申请号	CN03343024.1	申请日期	2003.05.28
申请人	夏普公司	发明人	木户口贵
分类号	13-03	主分类号	13-03
代理机构	北京市柳沈律师事务所	代理人	马涛;朱勤
主权项
地址	日本大阪府

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