| 摘要 |
<p>991,812. Solid state devices. WESTING- HOUSE BRAKE & SIGNAL CO. Ltd. July 26, 1963 [Sept. 12, 1962], No. 34886/62. Heading H1K. A semi-conductor device is assembled by sealing a lead into one end of a glass tube then assembling a semi-conductor PN junction element to one end of a further lead and subsequently inserting the sub-assembly into the tube so that the element electrically connects with the first lead, and thereafter sealing the glass tube to the second lead. The first lead 3, in the embodiment, may have a contact and heat sink member 6 joined to one end thereof prior to the insertion into the open tube end of the subassembly, which comprises a lead 2, joined to or integral with a flexible portion 4, and a semiconductor element 5. The joint between the element 5 and the flexible portion 4 may be effected by hard soldering or thermo-compression bonding and if the flexible portion 4 is not integral with the remainder of lead 2 it may be joined to it by soft soldering.</p> |
