发明名称 |
Electroless platinum-rhodium alloy plating |
摘要 |
The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate. More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article formed therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers and powders.
|
申请公布号 |
US6706420(B1) |
申请公布日期 |
2004.03.16 |
申请号 |
US20000611182 |
申请日期 |
2000.07.06 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
KOZLOV ALEXANDER S.;PALANISAMY THIRUMALAI;NARASIMHAN DAVE |
分类号 |
C23C18/44;C23C18/48;H05K3/24;(IPC1-7):B32B15/00;B05D1/18;C23C18/16;C23C18/42 |
主分类号 |
C23C18/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|