发明名称 |
System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
摘要 |
A system and method for polishing semiconductor wafers includes a variable partial pad-wafer overlap polisher having a reduced surface area, fixed-abrasive polishing pad and a polisher having a non-abrasive polishing pad for use with an abrasive slurry. The method includes first polishing a wafer with the variable partial pad-wafer overlap polisher and the fixed abrasive polishing pad and then polishing the wafer in a dispersed-abrasive process until a desired wafer thickness is achieved.
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申请公布号 |
US6705930(B2) |
申请公布日期 |
2004.03.16 |
申请号 |
US20010754480 |
申请日期 |
2001.01.04 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
BOYD JOHN M.;GOTKIS YEHIEL;KISTLER ROD |
分类号 |
B24B37/04;B24B37/26;B24B49/04;B24B51/00;B24B53/007;B24B53/017;H01L21/304;(IPC1-7):B24B29/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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