发明名称 |
Method for improving thermal process steps |
摘要 |
A method for controlling temperature of a semiconductor wafer in a process chamber includes heating the chamber from a starting temperature to a stabilizing temperature at a heating rate of approximately 12 degrees Celsius per second and maintaining the chamber at the stabilizing temperature for a selected stabilization period. The chamber is then heated from the stabilizing temperature to a process temperature at a heating rate of approximately 10 degrees Celsius per second. This process temperature is maintained for a selected processing period. After the period, the chamber is cooled to an exit temperature at a selected low cooling rate.
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申请公布号 |
US6706616(B1) |
申请公布日期 |
2004.03.16 |
申请号 |
US20020914749 |
申请日期 |
2002.01.14 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
KEGEL WILHELM;SCHUSTER THOMAS |
分类号 |
H01L21/316;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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