发明名称 |
Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using |
摘要 |
A chemical mechanical polisher that is equipped with a chilled wafer holder and a chilled polishing pad and a method for operating the chemical mechanical polisher are described. A first heat exchanging fluid is flown into a membrane chamber inside the wafer holder in intimate contact with the backside of the wafer such that the wafer can be sufficiently cooled. A second heat exchanging fluid is circulated in a plurality of surface grooves, or fluid channels provided in the bottom surface of the polishing pad to sufficiently cool the polishing pad during a chemical mechanical polishing process. The slurry suspension contained in-between the wafer surface and the polishing pad can thus be sufficiently cooled.
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申请公布号 |
US6705923(B2) |
申请公布日期 |
2004.03.16 |
申请号 |
US20020132446 |
申请日期 |
2002.04.25 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
LIU CHI-WEN;WAN YING-LANG |
分类号 |
B24B37/04;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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