| 摘要 |
The present invention describes an apparatus that includes a polish pad, the polish pad including a first through-opening; a vertical distribution layer located below the polish pad, the vertical distribution layer connected to the through-opening; a lateral distribution layer located below the vertical distribution layer, the lateral distribution layer connected to the vertical distribution layer; and a slurry dispense located over a front-side of the polish pad, the slurry dispense to provide a slurry to be transported through the polish pad to the lateral distribution layer.The present invention further describes a method including dispensing a slurry at a front-side of a polish pad; flowing the slurry to a location below the polish pad; flowing the slurry upwards and outwards, towards edges of the polish pad; and distributing the slurry to an upper surface of the polish pad.
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