发明名称 Two stage cooling system employing thermoelectric modules
摘要 A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.
申请公布号 US6705089(B2) 申请公布日期 2004.03.16
申请号 US20020115903 申请日期 2002.04.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHU RICHARD C.;ELLSWORTH, JR. MICHAEL J.;SIMONS ROBERT E.
分类号 F25B21/02;F25B25/00;H01L23/473;H01L35/30;(IPC1-7):F25B21/02;F25D23/12 主分类号 F25B21/02
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