| 摘要 |
A package of a semiconductor chip with array-type bonding pads. The semiconductor chip has a plurality of bonding pads located about periphery of the chip, in which the semiconductor chip is characterized at the bonding pads being positioned in at least four rows along each side of the chip, the four rows comprising an inner row, a mid-inner row, a mid-outer row, and an outer row. The inner row and the mid-inner row of the bonding pads consist of signal pads, and the outer row and the mid-outer row of the bonding pads consist of power pads and ground pads.
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