| 发明名称 |
Bumped integrated circuits for optical applications |
| 摘要 |
An optical integrated circuit application where the integrated circuit is packaged in a clear molding material and is attached to a printed circuit board having an aperture is described. The integrated circuit senses and/or emits light through the clear molding material and through the aperture in the printed circuit board.
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| 申请公布号 |
US6707148(B1) |
申请公布日期 |
2004.03.16 |
| 申请号 |
US20020153269 |
申请日期 |
2002.05.21 |
| 申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
MOSTAFAZEDEH SHAHRAM;SMITH JOSEPH O. |
| 分类号 |
H01L23/31;H01L23/433;H01L27/15;H01L31/0203;H01L33/54;H01L33/62;H01L33/64;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/31 |
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