发明名称 Chip interconnect bus
摘要 An interconnect bus for a microelectromechanical system is disclosed. Various attributes for an electrical trace bus that facilitate the routing of signals throughout at least a portion of the system and/or the layout of the microelectromechanical system on a wafer are disclosed.
申请公布号 US6707077(B2) 申请公布日期 2004.03.16
申请号 US20020100173 申请日期 2002.03.16
申请人 MEMX, INC. 发明人 MILLER SAMUEL LEE
分类号 G02B26/08;H01L27/10;(IPC1-7):H01L27/10 主分类号 G02B26/08
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