CARRIER INCLUDING MULTI-VOLUME DIAPHRAGM FOR POLISHING SEMICONDUCTOR WAFER AND METHOD THEREFOR

摘要

PURPOSE: A carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor are provided to apply the uniform pressure on all areas of the semiconductor wafer by improving a structure of the carrier. CONSTITUTION: A rigid plate(34) includes a major surface. The first diaphragm(40) of soft and flexible material includes the first section for contacting the first surface portion of the workpiece. The first diaphragm is connected to the rigid plate, extends across at least the first portion of the major surface, and thereby defines the first cavity therebetween. The second diaphragm(42) of soft and flexible material includes the second section for contacting the second surface portion of the workpiece. The second diaphragm is connected to the rigid plate, extends across at least the second portion of the major surface, and thereby defines the second cavity therebetween. A plurality of fluid conduits are used for connecting a source of pressurized fluid to at least one of the cavities.