| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card highly improved at its warpage. SOLUTION: The IC card includes a card substrate 1 to be the center layer of multi-layer structure, a spacer layer 5 arranged on the 1st main surface side of the substrate 1, a plurality of parts 2 to 4 buried in the spacer layer 5, a film 6 arranged on the 2nd main surface side of the substrate 1 and made of the same material and having the same film thickness as the spacer layer 5, a 1st skin layer 7 attached to the spacer layer 5 as the outermost layer of the multi-layer structure, and a 2nd skin layer 8 made of the same material and having the same film thickness as the 1st skin layer and attached to the rear surface of the film 6 as the other outermost layer of the multi-layer structure. |
