| 摘要 |
PURPOSE: A semiconductor package is provided to prevent warpage and to lengthen fatigue lifetime of a solder ball by using a stiffener. CONSTITUTION: A BGA(Ball Grid Array) package further includes a stiffener(500) with a high elastic modulus. A semiconductor chip(200) is attached on the stiffener by using a tape(400). The semiconductor chip(200) is molded by an EMC(Encapsulation Molding Compound)(300). Solder balls(600) are formed at back side of the stiffener(500).
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