发明名称 HEAT TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To reduce heat loss from a furnace for heat treatment in supplying an electric power to the furnace and in measuring the temperature inside the furnace. <P>SOLUTION: A micro-flow path 43 is formed inside a steam reforming reactor 32. A reforming catalyst film 46 is formed on the inner wall and the ceiling of the micro-flow path 43, and a heating resistance film 47 is formed on the floor of the micro-flow path 43. The heating resistance film 47 is connected to an outer power source 60 by lead wires 48, 49, and electric power is supplied from the power source 60 through the lead wires 8, 49 to the heating resistance film 47. The electric resistance of the heating resistance film 47 depends on the temperature. The voltage and current applied to the heating resistance film 47 are measured at the power source 60, and the resistance of the heating resistance film 47 is obtained from the measured voltage and current. Resultingly, the temperature of the micro-flow path 43 can be measured. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004075480(A) 申请公布日期 2004.03.11
申请号 JP20020240460 申请日期 2002.08.21
申请人 CASIO COMPUT CO LTD 发明人 NAKAMURA OSAMU;TAKEYAMA HIROYUKI
分类号 C01B3/38;H01M8/06 主分类号 C01B3/38
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