| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein wasteful steps are eliminated in the manufacturing process. <P>SOLUTION: An adhesive tape 46 for bonding with an upper chip 44 is applied to the top surface of a lower chip 43 judged acceptable in a probe test, but nothing is done for the top surface of a lower chip 43a judged defective in the probe test. A taping material 53 for dice attachment is applied to the rear surface of a wafer 51 wherein the lower chip 43 is built, and a UV tape material for dicing is attached to the rear surface of a wafer wherein the upper chip 44 is built. <P>COPYRIGHT: (C)2004,JPO |
