| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal heater capable of rapidly heating a semiconductor wafer or the like without causing large temperature dispersion therein in heating, and of preventing occurrence of camber or flexure in a metal plate. SOLUTION: This metal heater is composed of a plurality of the metal plates and a heating element. The metal heater is characterized by that the heating element is caught between the plurality of metal plates; and the thickness of the metal plate on the heating surface side is equal to or smaller than that of the metal plate on the side opposite to the heating surface. COPYRIGHT: (C)2004,JPO
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