发明名称 SUBSTRATE HOLDER AND PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To widen an effective area used as a pattern-forming region of a substrate, further to hold the substrate while easily centralizing it, and to easily and surely take out the substrate. SOLUTION: In a substrate holder for releasably holding the substrate W by putting the substrate W between a fixed holding member 54 and a movable holding member 58 provided with a sealing member 60, pushing the movable hold member 58 toward the fixed hold member 54, and sealing a region surrounding the peripheral edge of the substrate W with the sealing member 60, this substrate holder has electrical contacts 92 of a flat spring form, which are electrically connected to an electric conductor 88 in the region sealed by the sealing member 60 and pass an electric current to the substrate W, when the fixed hold member 54 holds the electric conductor 88, and the movable hold member 58 holds the substrate W with itself and the fixed holding member 54. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004076022(A) 申请公布日期 2004.03.11
申请号 JP20020213209 申请日期 2002.07.22
申请人 EBARA CORP 发明人 YOSHIOKA JUNICHIRO;HORIE KUNIAKI;KAKU YOKOU
分类号 C25D17/06;C25D17/08;H01L21/60;(IPC1-7):C25D17/06 主分类号 C25D17/06
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