发明名称 Method for embedding an air dielectric transmission line in a printed wiring board(PCB)
摘要 An air dielectric printed circuit board fabrication method is disclosed based on the principles of suspended substrate transmission lines as used in microwave assemblies. The transmission line conductor is on a thin dielectric layer suspended in air between two conductive planes. The ground in the area around the transmission line may be cut back either by milling or by photo-etching to preclude shorting the transmission line.
申请公布号 US2004048420(A1) 申请公布日期 2004.03.11
申请号 US20030601464 申请日期 2003.06.23
申请人 MILLER RONALD BROOKS 发明人 MILLER RONALD BROOKS
分类号 H01P3/08;H05K1/02;(IPC1-7):H01L21/44 主分类号 H01P3/08
代理机构 代理人
主权项
地址