发明名称 |
Method for embedding an air dielectric transmission line in a printed wiring board(PCB) |
摘要 |
An air dielectric printed circuit board fabrication method is disclosed based on the principles of suspended substrate transmission lines as used in microwave assemblies. The transmission line conductor is on a thin dielectric layer suspended in air between two conductive planes. The ground in the area around the transmission line may be cut back either by milling or by photo-etching to preclude shorting the transmission line.
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申请公布号 |
US2004048420(A1) |
申请公布日期 |
2004.03.11 |
申请号 |
US20030601464 |
申请日期 |
2003.06.23 |
申请人 |
MILLER RONALD BROOKS |
发明人 |
MILLER RONALD BROOKS |
分类号 |
H01P3/08;H05K1/02;(IPC1-7):H01L21/44 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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