| 摘要 |
PURPOSE: A stack package and a fabricating method thereof are provided to reduce the manufacturing cost by using only a connection pin without a polyimide film. CONSTITUTION: A stack package includes a panel(34), a connection pin(36), and an input/output terminal(38). A plurality of FBGA packages(32A,32B) and a circuit pattern(34a) are formed on a center part of an upper face of the panel(34). The circuit pattern(34a) is electrically connected to the FBGA packages(32A,32B). The panel further includes a through-hole(34b) connected to the circuit pattern(34a). The connection pin(36) is inserted into the through-hole(34b) in order to connect electrically the stacked FBGA packages(32A,32B) with each other. The input/output terminal(38) is used for inputting and outputting signals of the FBGA packages(32A,32B).
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