SEMICONDUCTOR DEVICE AND ITS PRODUCING PROCESS, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To grind a semiconductor substrate to a substantially constant thickness while enhancing the productivity and yield.

SOLUTION: A protrusion 40 is formed on a semiconductor substrate 10 having a first region 20 and a second region 30 on the periphery thereof to project above the first region 20. A support 60 is provided on the side of the semiconductor substrate 10 where the protrusion 40 is formed such that a part overlapping the first region 20 becomes a through hole 61. The semiconductor substrate 10 is ground from the side of the semiconductor substrate 10 opposite to the side where the protrusion 40 is formed.

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